Single-part and Small-scale Production of Interconnection Ceramic Printed Circuit Boards

    • Single-part and Small-scale Production of Interconnection Ceramic Printed Circuit Boards

    Purpose:
    Interconnection printed circuit boards are intended for transmitting-receiving radio equipment units operating within microwave range.
    Year of release: 1980
    Guaranteed service life (years):
    Depends on product requirements.
    Estimated production / delivery time (months):
    Based on the degree of product complexity.
    Flight qualification of the product: No
    Possibility to adapt the product to customer requirements: Yes
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    Parameter Value
    Maximum size of interconnection printed circuit board, mm 48х60
    Minimum conductor size, µm 50
    Minimum conductor to conductor clearance, µm 50

    Description

    Manufacturing of interconnection ceramic printed circuit boards from polycarbonate, sitall and leucosapphire materials.

    Legal information
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